E hoʻopaʻa i nā ʻāpana metala alumini
wehewehe
ʻAno Huahana | huahana hoʻopilikino | |||||||||||
Hana Hookahi | ʻO ka hoʻomohala ʻana a me ka hoʻolālā-hoʻouna ʻana i nā laʻana-batch production-inspection-surface treatment-packaging-delivery. | |||||||||||
Kaʻina hana | hehi, kulou, kiʻi hohonu, hana ʻia me ka pepa, wili, ʻoki laser etc. | |||||||||||
Nā mea waiwai | kalapona kila, stainless steel, aluminika, keleawe, galvanized kila etc. | |||||||||||
Anana | e like me nā kaha kiʻi a ka mea kūʻai aku. | |||||||||||
Hoʻopau | E kāpīpī i ka pena, electroplating, hot-dip galvanizing, powder coating, electrophoresis, anodizing, blackening, etc. | |||||||||||
Wahi noi | ʻO nā ʻāpana kaʻa, nā ʻāpana mīkini mahiʻai, nā ʻāpana mīkini ʻenekinia, nā ʻāpana ʻenekinia kūkulu, nā lako kīhāpai, nā ʻāpana mīkini pili i ke kaiapuni, nā ʻāpana moku, nā ʻāpana mokulele, nā paipu paipu, nā ʻāpana hāmeʻa, nā ʻāpana pāʻani, nā ʻāpana uila, etc. |
Pono
1. Ma mua o 10 makahikio ka ike kalepa ma na aina e.
2. Hoolakolawelawe hoʻokahimai ka hoʻolālā mold i ka lawe ʻana i nā huahana.
3. ʻO ka manawa hāʻawi wikiwiki, e pili ana30-40 mau lā. Loaʻa i loko o hoʻokahi pule.
4. ʻO ka hoʻokele maikaʻi a me ke kaʻina hana (ISOmea hana hōʻoia a me ka hale hana).
5. ʻOi aku nā kumukūʻai kūpono.
6. ʻOihana, loaʻa i kā mākou hale hanaʻoi aku ma mua o 10makahiki o ka mōʻaukala ma ke kahua o ka metala stamping sheet metala.
Hoʻoponopono maikaʻi
Vickers mea paʻakikī.
Mea hoʻohana ʻikena.
Mea kani spectrograph.
ʻEkolu mea kani hoʻohui.
Kii Hoouna
Kaʻina Hana Hana
01. Mold design
02. Hoʻoheheʻe ʻia
03. ʻO ka hana ʻoki uea
04. Mold wela lapaʻau
05. Hui poni
06. Mold debugging
07. Ka hoopau ana
08. electroplating
09. Ho'āʻo Huahana
10. Pūʻolo
Hōʻike ʻoihana
Ma ke ʻano he mea hoʻolako nui o Kina i ka metala pepa stamped, ʻo Ningbo Xinzhe Metal Products Co., Ltd. e kālele ana i ka hana ʻana i nā ʻāpana kaʻa, nā ʻāpana mīkini mahiʻai, nā ʻāpana ʻenekinia, nā ʻāpana ʻenekinia kūkulu, nā lako lako, nā ʻāpana mīkini ʻenehana, nā ʻāpana moku, nā ʻāpana mokulele. , paipu paipu, lako lako, mea paani, a me na lako uila, a me na mea e ae.
Loaʻa nā ʻaoʻao ʻelua mai ko mākou hiki ke hoʻomaopopo piha i ka mākeke i manaʻo ʻia a hāʻawi i nā ʻōlelo aʻoaʻo kūpono e kōkua i kā mākou mea kūʻai aku e loaʻa ka ʻāpana mākeke nui aʻe. Hoʻolaʻa mākou i ka hāʻawi ʻana i kā mākou mea kūʻai aku i ka lawelawe koʻikoʻi a me nā ʻāpana premium i mea e loaʻa ai kā lākou hilinaʻi. E hoʻopaʻa i nā pilina paʻa me nā mea kūʻai aku o kēia manawa a e ʻimi ikaika i nā ʻoihana hou i nā ʻāina ʻaʻohe hoa e hoʻoikaika i ka launa pū ʻana.
Kaʻina hoʻokahe
Hoʻokomo pinepine ʻia kēia mau ʻanuʻu i loko o ke kaʻina hana oxidation:
1. Ka hānai meaʻai: E hoʻohana i nā paipu e hoʻolako i nā mea maka i ka reactor i mea e mālama ai i ke koena kūpono o nā mea maka i loko.
2. Pane: No ka hoʻokō ʻana i ka hopena oxidation, hoʻohui i ka oxygen i ka reactor a hoʻoponopono i nā ʻāpana hoʻohālikelike (e like me ka mahana, ke kaomi, a me ka manawa pane).
3. Hoʻokaʻawale ʻana i ka huahana: E hoʻohana i kahi mea hoʻoheheʻe ea e hoʻomālili i ka huahana i hoʻopili ʻia, e hoʻohuli iā ia mai kahi kinoea i loko o kahi ʻano wai a paʻa paha, a laila hoʻohana i kahi mea hoʻokaʻawale e hoʻokaʻawale i nā huahana mai nā ʻāpana like ʻole.
4. Hoʻomaʻemaʻe: E hōʻoia i ka hopena o ka huahana i ka maʻemaʻe pono, e hoʻomaʻemaʻe.
5. Packaging: Ma hope o ka hoʻomaʻemaʻe ʻia ʻana o nā huahana, hoʻopili ʻia lākou e like me nā alakaʻi a me nā kūlana ma mua o ke kūʻai ʻia ʻana i nā mea kūʻai aku a i ʻole e hoʻouna ʻia i ka pae aʻe o ka hana.
Ma kekahi mau noi kiko'ī, e like me ka semiconductor wafer processing, ke kaʻina hana oxidation e pili pū ana i ka hāʻawi ʻana i nā oxidants (e like me ka wai, oxygen) a me ka ikehu wela ma ka substrate silicon e hana i kahi kiʻiʻoniʻoni silicon dioxide (SiO2). Mālama kēia kiʻi oxide i ka wafer ma ka pale ʻana i ka leakage mai ke kahe ʻana ma waena o nā kaʻapuni, pale i ka hoʻopuehu ʻana i ka wā o ke kaʻina hana implantation, a me ke ʻano he kiʻi anti-etching e pale ai i ke kuhi hewa ʻana i ke kaʻina hana etching.